Yesterday, the CHIPS Implementation Steering Council met for the first time to discuss the implementation plan for the CHIPS and Science Act. The bipartisan CHIPS and Science Act was signed into law on August 9, 2022. The Act makes historic investments to strengthen the American semiconductor industry through manufacturing, research and development, and workforce investments. The August 25, 2022 Executive Order on the Implementation of the CHIPS Act of 2022 established the Steering Council to coordinate and develop the policies needed to effectively implement the Act within the executive branch.
In the Steering Committee’s inaugural meeting, participants discussed how implementation of the Act will strengthen American leadership in the semiconductor industry, boost our economic competitiveness, and protect our national security. NEC Director Brian Deese (Council Co-Chair) emphasized the need for coordination across agencies on research and development, workforce investments, and protecting taxpayer dollars. NSC Director Jake Sullivan (Co-Chair) addressed the geopolitical competition in semiconductors and the importance of chips to American national security. OSTP Director Arati Prabhakar (Council Co-Chair) highlighted the need to articulate strategic capability and capacity objectives to guide implementation, while also sustaining our commitment to research and development to ensure that America remains at the forefront of building the technologies of the future. The White House Coordinator for CHIPS Implementation Ronnie Chatterji provided an overview of the implementation process and how the whole-of-government approach will be coordinated.
Council members also received briefings from the Department of Commerce, the Department of State, the Department of Defense, and the Director of the National Science Foundation on the status of their implementation efforts. Secretary of Commerce Gina Raimondo presented on the Department of Commerce’s roadmap and priorities for administering the manufacturing incentives program and R&D funding provided under the Act. Deputy Secretary of Defense Kathleen Hicks laid out the Department of Defense’s plan for ensuring accessibility to semiconductor chips that are integral to American defense systems and leveraging CHIPS R&D funding to maintain a competitive edge. Deputy Secretary of State Wendy Sherman explained how the State Department will work to build secure and reliable semiconductor supply chains through diplomatic engagement with allied and partner countries. The Director of the National Science Foundation Sethuraman Panchanathan addressed how the country will invest in its semiconductor workforce. The Council also discussed the guardrails in place to ensure that manufacturing incentives funds are used in ways that protect US taxpayer dollars, benefit local communities, and safeguard national security.
Participants in yesterday’s meeting included:
- Assistant to the President for Economic Policy Brian Deese (Co-Chair)
- Assistant to the President for National Security Affairs Jake Sullivan (Co-Chair)
- Assistant to the President for Science and Technology Arati Prabhakar (Co-Chair)
- Secretary of Treasury Janet Yellen
- Secretary of Commerce Gina Raimondo
- Director of National Intelligence Avril Haines
- Director of the Office of Management and Budget Shalanda Young
- Administrator of the Small Business Administration Isabel Guzman
- Director of the National Science Foundation Sethuraman Panchanathan
- Deputy Secretary of State Wendy Sherman
- Deputy Secretary of Defense Kathleen Hicks
- Under Secretary of Energy for Science and Innovation Geri Richmond
- Senior Advisor to the President for Public Engagement Keisha Lance Bottoms
- Principal Deputy National Cyber Director Kemba Walden
- Director of the Department of Labor’s Good Jobs Initiative Katelyn Walker Mooney
- Chief Economic Advisor to the Vice President Deanne Millison
- White House Coordinator for CHIPS Implementation Ronnie Chatterji